Voxel applies PECM to semiconductor gas and fluid delivery components where internal surface quality, feature consistency, and defect avoidance directly impact tool uptime and yield. Our PECM processes enable burr-free internal finishing, precise microhole arrays, and smooth internal flow paths in materials such as copper, stainless steels, and nickel-based alloys. Using custom-designed cathodes, we achieve high feature-to-feature and part-to-part repeatability, making PECM well suited for manifolds, flow control plates, and other UHP components where particle generation, internal cracking, or geometric variation are unacceptable.

For wafer processing equipment and tooling subsystems, Voxel supports components that demand tight geometric control, repeatable precision features, and non-contact material removal to avoid residual stress or damage. PECM enables the ability to machine and finish complex internal and external features without introducing burrs or tool-induced defects. Examples include arrays of slots, holes, and thin sections. Our approach is particularly effective for custom or production tooling where consistent replication across parts is critical, and where traditional machining or EDM can introduce variability that degrades process stability over time.

Voxel’s PECM capabilities extend to semiconductor thermal infrastructure, including components that rely on internal channels, microfeatures, or thin-wall geometries to manage heat efficiently. We support internal surface finishing and feature generation in thermally conductive materials, enabling improved flow uniformity and reduced risk of crack initiation in high-stress regions. By leveraging custom cathodes and controlled pulsed electrochemistry, we deliver repeatable results across production volumes, supporting thermal management components where reliability, consistency, and long-term performance are essential.