EDUCATION PORTAL 

In this article, we’ll explain why conventional processes struggle with these evolving demands, how PECM overcomes the thermal and mechanical limitations inherent to laser drilling and CNC, and how these capabilities unlock new possibilities across semiconductors, power electronics, and medical device applications where microhole arrays directly define performance. 

In this article, we’ll discuss how non-line-of-sight machinability and internal finishing is becoming increasingly critical for handling toxic gases in semiconductor manufacturing and beyond, and how PECM’s ability to machine and finish complex internal features can be utilized in-parallel with AM-enabled designs in the semiconductor manufacturing space and other key parts like heat exchangers to enable safer and more efficient internal designs.  

PECM’s distinctive material removal capabilities open new design freedom for manufacturers empowering engineers to achieve features and geometries that were previously impractical or cost-prohibitive.

As AI chips scale up in demand, power density, and heat flux, liquid cooling plates with extreme-tolerance microchannels are increasingly critical for serving the entire next generation of global tech. PECM may enable manufacturers to meet the significant challenges of dealing with unprecedented power densities and thermal loads in AI-enabled data centers with its ability to machine sub-micron surface finishes, ultra-tight geometries, and high scalability in-parallel.

Voxel Founder & CEO Daniel Herrington is speaking at the Heat Exchanger Worlds conference in October on how pulsed electrochemical...

Join Voxel Founder & CEO Daniel Herrington on stage at MD&M Midwest as he discusses how pulsed electrochemical machining (PECM) is...

In the newest episode of 3Dprint.com 's podcast, 3DPod , Voxel's very own VP of Engineering, Mark Barfoot, was interviewed regarding his...